Technical resource
Contamination standards should represent the process challenge—not merely add particles to a wafer.
Define the material, particle range, loading pattern, substrate and acceptance method around the study objective.
Ownership disclosure: Particle Wafer Standards is owned and published by Applied Physics Corporation. Product links may lead to AppliedPhysicsUSA.com. The technical guidance is designed to remain useful whether or not a visitor requests a quote.
Applications
Common objectives
- Cleaning-process evaluation
- Wet-bench or tool performance
- Handling and transport studies
- Inspection sensitivity checks
- Process-transfer and recovery studies
- Training and method development
Substrate control
Control the background
The base wafer background and pre-existing defects can compromise the interpretation. Specify surface condition, allowable background, packaging and handling.
Particle material
Choose representative contamination
PSL provides controlled spherical standards. Silica and other materials may better represent certain process or optical conditions. Use the material that answers the technical question.
Measurement plan
Plan the readout
Define how the wafer will be inspected before and after the process, how counts will be reconciled, what constitutes recovery and how uncertainty will be handled.
Need help matching equipment to the study?
Applied Physics can review the airflow area, test objective, desired visibility, operating duration and deployment constraints.
Talk with Applied Physics